Clearance Summary
MEDICON 2.4 MANDIBULAR RECONSTRUCTION PLATING SYSTEM received FDA 510(k) clearance under submission number K043297, sponsored by Medicon EG. The device was reviewed via the Special premarket notification pathway and assigned to the Dental review panel. The statutory decision date of record is 2005-02-23.
- Submission: K043297
- Applicant / Sponsor: Medicon EG
- Clearance pathway: Special
- Review panel: Dental
- Device class: Class II
- Regulation citation: 21 CFR 872.4760
- Decision date: 2005-02-23
Classification & Regulation
This clearance is catalogued under FDA product code JEY and 21 CFR 872.4760, within the Dental review panel as a Class II device.