Clearance Summary
HY-BOND RESIGLASS received FDA 510(k) clearance under submission number K111855, sponsored by Shofu Dental Corp.. The device was reviewed via the Traditional premarket notification pathway and assigned to the Dental review panel. The statutory decision date of record is 2011-11-17.
- Submission: K111855
- Applicant / Sponsor: Shofu Dental Corp.
- Clearance pathway: Traditional
- Review panel: Dental
- Device class: Class II
- Regulation citation: 21 CFR 872.3275
- Decision date: 2011-11-17
Classification & Regulation
This clearance is catalogued under FDA product code EMA and 21 CFR 872.3275, within the Dental review panel as a Class II device.