Clearance Summary
BIOBOND C&B POST SOLDER received FDA 510(k) clearance under submission number K770009, sponsored by Dentsply Intl.. The device was reviewed via the Traditional premarket notification pathway and assigned to the Dental review panel. The statutory decision date of record is 1977-01-10.
- Submission: K770009
- Applicant / Sponsor: Dentsply Intl.
- Clearance pathway: Traditional
- Review panel: Dental
- Device class: Class II
- Regulation citation: 21 CFR 872.3060
- Decision date: 1977-01-10
Classification & Regulation
This clearance is catalogued under FDA product code EJT and 21 CFR 872.3060, within the Dental review panel as a Class II device.